Changing RF Design. Forever.™
RSS Feed
Support Community 
... ...

  Home    News & Events    Products    Applications Support    UltraCMOS™ Process    Quality    About Us    Careers    Contact

... ...
... ...

What's New


August 2011: MagnaChip and Peregrine Announce Volume Ramp

New Products: Read about our most recent portfolio additions

... ...
... ...

Applications Support


Product Documentation

   Switches
   DSAs
   DuNE™ DTCs
   Mixers
   PLLs
   All Products

Design Support

   Application Notes
   Datasheet Library
   Package Information
   Discontinued Products Listing
   Technical FAQs
   Contact Apps Support
... ...
... ...
 Simply Designed.
 Simply Green.
 Only UltraCMOS™.
... ...
... ...

Applications Support: Package Information

Choose from a variety of packaging options to design-in the device that suits your application. Here are some links that may be useful to you:

  • Hazardous/Banned Substance Certificate of Conformance
  • Material Declaration Forms
  • Green Packaging Information
  • MSL3 Handling Requirements
  • JEDEC specification for solder reflow profiles
... ...
... ...
Green Commercial Package Information

Environmentally-friendly, lead-free (Pb-free) and RoHS compliant package options are indicated with RoHS Compliant.
Click below to view the materials declaration form for each packaged product.

       
Wire-bond Die         6L SC70RoHS Compliant, click for materials declaration        6L DFNRoHS Compliant, click for materials declaration
     and Flip Chip         1.3x2.0x1.0            3.0x3.0x0.9
           MSL 1                   MSL 1                   MSL 1 		      
     8L MSOPRoHS Compliant, click for materials declaration    8L TSSOPRoHS Compliant, click for materials declaration    10L QFNRoHS Compliant, click for materials declaration
   3.0x3.0x1.1        3.0x4.4x1.1         2.0x2.0x0.45
       MSL 1                MSL 3                  MSL 1
                                               
12L QFNRoHS Compliant, click for materials declaration        16L QFNRoHS Compliant, click for materials declaration       20L 4x4 QFNRoHS Compliant, click for materials declaration     24L 4x4 QFNRoHS Compliant, click for materials declaration          32L 5x5 QFNRoHS Compliant, click for materials declaration                48L QFNRoHS Compliant, click for materials declaration
3.0x3.0x0.75            3.0x3.0x0.75            4.0x4.0x0.9            4.0x4.0x0.9                 5.0x5.0x0.9                       7.0x7.0x0.9
MSL 1                    MSL 1                    MSL 1                    MSL 1                       MSL 1, MSL 3*                        MSL 3
Hi-Rel Package Information

                               
           8L CSOIC              7L CSOIC              28L CQFP                        44L CQFJ                          68L CQFJ
          4.6x4.6x1.8           6.6x5.46x1.8           9.1x9.9x1.3                   16.5x16.5x2.9                      24.1x24.1x3.1


*High-Power Switches PE42510A and PE41650A are MSL3. All other parts in this package are MSL1.
All dimensions listed in millimeters (width x length x height) and are approximate.
See product datasheets for exact dimensions.
... ...
... ...

Applications Support

... Product Documentation
... Knowledge Base and FAQs
... Ask a Question
... ...
... ...

Sales Support

...

Designing for tomorrow's challenging RF applications? Contact your local sales representative to find the best
high-performance solution.

... ...
... ...

We're Hiring

...

Looking for a place to apply your skills where they will count?
View all open positions.

... ...

Changing How RF is Designed. Forever.™

Home       News and Events       Products       Applications Support       UltraCMOS™ Process       Quality       About Us       Careers       Contact      

©2010-2012 Peregrine Semiconductor Corp.     Legal Info     Site Map