Environmentally Friendly Packaging Options
UltraCMOS™ Die
A Silicon-on-Sapphire die is inherenty RoHS compliant because it uses .01% or less of hazardous substances as defined by
Directive 2002/95/EC. The PE42692 Materials Declaration Form for our popular SP9T antenna switch in Flip Chip packaging gives a typical example of the
materials used to create one of our products.
Commercial Packages
Peregrine Semiconductor is proud to offer Lead-Free (Pb-free) and
Hazardous/Banned Substance compliant versions
of the most popular packages for its UltraCMOS™ products in order to reduce hazardous substances.
All Lead-free products use matte tin plating (Sn) onto copper lead frames,
rather than tin-lead (PbSn) solder that is used on standard products. The electronics
industry has considerable experience with matte Sn finishes, which have been widely
used. The reliability aspects of matte Sn plating have been well-researched,
including solderability with both Pb-free and standard SnPb solders, and low whisker growth
even in accelerated temperature/humidity conditions.
New Pb-free products are developed and released on a regular
basis depending upon market demand and other factors. As new products
are introduced and regulatory conditions change, Peregrine will maintain
its commitment to doing its part to preserve our environment. If the Pb-free
solution that you need is not shown, please consult with Peregrine or any of its
worldwide sales representatives for solutions to your specific requirements.
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