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Hpa catalog cover 2015

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Hpa catalog cover 2015

Find out more about our latest products.

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NEWSROOM: From the founders of RF SOI


Taking Intelligent Integration Around the World

In mid-September 2014, we kicked off our intelligent integration campaign with a Microwave Journal webinar hosted by Peter Bacon. For those of you who missed this informative webinar, the replay is available here. This webinar marked the launch of intelligent integration—a topic Peregrine literally took around the world. This intelligent integration concept centered around our ability to integrate RF, digital and analog components onto a single die. While integration has traditionally offered high-volume markets the benefit of lower cost, Peregrine uses intelligent integration to offer performance advantages such as configurability, flexibility, reliability, repeatability, ease-of-use and a reduced form factor. Probably the best example of this concept is Global 1.
 
Over the last few weeks, our VP of marketing, Duncan Pilgrim, and Peregrine Semiconductor Europe managing director, Mark Moffat, met in person with the media and analysts to share the intelligent integration news and introduce two other great examples of this concept—the True DC switch and the X-band core chip. Duncan had several media briefings in New York City and Boston, and Mark sat desk-side with key technical journalists in the UK and at European Microwave Week. Also at European Microwave Week, Mark Moffat and Peregrine co-founder Ron Reedy gave presentations related to Peregrine's integration capabilities. Last up on the intelligent integration agenda was a Beijing press conference on Oct. 14. Peregrine Semiconductor China engineer Rick Lain and Duncan hosted a successful event with several editors in attendance.

To view the intelligent integration press release that introduces the True DC switch and the X-band core chip, click here.

The Search for Intelligent Integration