PE43508

PE43508 Specs

Key Features

Wideband support up to 55 GHz
Glitch-safe attenuation state transitions
Flexible attenuation steps of 0.5 dB and 1 dB up to 31.5 dB
Extended +105 °C operating temperature
Parallel and serial programming interfaces with serial addressability
Flip-chip die

Specifications

Type

Description

Min Freq (MHz)

Max Freq (MHz)

Bits

Attn Range (dB)

Attenuation Step (dB)

Min IL (dB)

Max IL (dB)

IIP3 (dBm)

Interface

Package

Package (mm)

50Ω

6-bit; 64 states

0.009

55000

31.5

0.5/1.0

2.2

5.9

Parallel (Latched, Direct), Serial Addressable

Flip Chip

Schematics

Technical Resources

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Software

PRT69887 (EK43508-02) Layout

PRT69886 (EK43508-01) Layout

PRT69890 (EK43508-88) Layout

Application Note: Programming Multiple Devices Using a Single SPI Bus

Application Note: PE43508 55 GHz DSA Substrate Carrier Assembly Guide

Application Note: Thermal Characterization

RoHS Compliance Certificate

REACH Compliance Certificate