The PE561221 leverages the intelligent integration capabilities of pSemi's UltraCMOS technology platform to deliver exceptional performance, low power consumption and high reliability with 2 kV HBM ESD rating. Through advanced analog and digital design techniques, the Wi-Fi FEM delivers excellent long-packet EVM performance with less than 0.1 dB of gain droop while operating across the entire -40°C to 85°C temperature range. At -40 dB EVM (MCS9), the output power is +19 dBm with less than 0.05 dBm droop in power output after a 4 milliseconds packet. The IC delivers best-in-class dynamic error vector magnitude (DEVM) and current consumption without requiring digital pre-distortion (DPD), and it has excellent MCS11 performance for 802.11ax applications. The monolithic die uses a compact 16-pin, 2 x 2 mm LGA package ideal for either stand-alone use or in 4 x 4 MIMO and 8 x 8 MIMO modules.
Long-packet EVM Performance
2.4 to 2.5 GHz
+19 dBm Pout at -40 dB EVM (MCS9)
-40 to +85 C
16-pin, 2 x 2 mm LGA (MSL3)
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