2.4 GHz SOI Wi-Fi Front-end Module

 The PE561221 leverages the intelligent integration capabilities of pSemi's UltraCMOS technology platform to deliver exceptional performance, low power consumption and high reliability with 2 kV HBM ESD rating. Through advanced analog and digital design techniques, the Wi-Fi FEM delivers excellent long-packet EVM performance with less than 0.1 dB of gain droop while operating across the entire -40°C to 85°C temperature range. At -40 dB EVM (MCS9), the output power is +19 dBm with less than 0.05 dBm droop in power output after a 4 milliseconds packet. The IC delivers best-in-class dynamic error vector magnitude (DEVM) and current consumption without requiring digital pre-distortion (DPD), and it has excellent MCS11 performance for 802.11ax applications. The monolithic die uses a compact 16-pin, 2 x 2 mm LGA package ideal for either stand-alone use or in 4 x 4 MIMO and 8 x 8 MIMO modules.




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PE561221 Specs

Key Features

  • Monolithic SOI 2.4 GHz PA, LNA and SP3/4T switches
  • Fully matched input and output
  • High-performance SP3/4T supporting BT and Wi-Fi Tx/ Rx
  • Uses a smart bias circuit to deliver a high linearity signal and excellent long-packet EVM performance
  • Small 16-pin, 2x2 mm LGA package (MSL3)



Transmit Gain

Receive Gain

Long-packet EVM Performance

Temperature Range


2.4 to 2.5 GHz

28 dB

14 dB

+19 dBm Pout at -40 dB EVM (MCS9)

-40 to +85 C

16-pin, 2 x 2 mm LGA (MSL3)

Products displayed on this site are protected under one or more of the following U.S. Patents.

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